Line Solutions
Heller Oven

Heller SMT Reflow Ovens – Lead-Free Mark III Series

Heller Industries was founded in 1960 and pioneered convection reflow soldering in the 1980s. Over the years, Heller has partnered with its customers to continually refine their systems to satisfy advanced applications requirements. A pioneer in the introduction of forced convection reflow, and in-line continuous curing applications, Heller provides solutions for electronics manufacturers and assemblers worldwide.

The breakthroughs associated with the Mark III reflow system provide a very low cost-of-ownership. Heller’s heating and cooling advances in the Mark III reflow system deliver up to 40% reduction in nitrogen and electrical consumption.

  • Lead-Free Certified
  • Enhanced Heater Modules
  • New Flux Management System – Eliminates Maintenance
  • Intuitive Control System
  • Programmable Cooling
  • Integrated CPK Software

*ApexFA is able to offer the Heller reflow as either part of a complete line solution for new customers, or as an alternative reflow solution to existing ApexFA customers.

The 1700 models support high-mix/medium-volume throughput at speeds up to 24″ (60cm) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity regardless of component density or board loading, with identical profile performance in either air or nitrogen.

Highest Yields and Tight Process Control

  • The most efficient heat transfer from extra-high volume, high-velocity heating modules producing heater module response of less than one second to temperature changes of less than 0.1ºC, thereby maintaining profile integrity for heavy board loads.
  • Wide process window for “universal profiling” allows many different boards to be run on a single temperature profile.
  • Advanced 5 thermocouple PCB profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs.

With a high-capacity, 26″ wide heater module, the 1800 Mark III series offers unmatched flexibility in board handling. The oven may be fitted with an adjustable single-rail edge hold conveyor/mesh belt combo to carry even the largest boards or multi-board panels (up to 20″ wide) through the oven.

This new flux collection system traps the flux in a separate collection box with easy-to-remove plates. As a result, the oven tunnel is kept clean – thus saving time consuming P.M. A collection jar captures the flux and can be removed while the oven is running for the ultimate in time savings.

Enhanced flow heater modules, with 40% larger impeller, blanket the PCB with heat for the lowest delta Ts on the toughest boards. Additionally, the Uniform Gas Management system eliminates net flow, resulting in nitrogen consumption reductions of up to 40%.

Four lead screws ensure the tightest tolerances and parallelism – even on boards with 3mm clearance at the edges.

The new Blow Thru Cooling module provides cool rates of >3º C/sec – even on LGA 775; a rate meets even the most demanding lead-free profile requirements.

Powered by ECD, this innovative software package provides three levels of process control from Oven CpK to Process CpK and Product Traceability, this software ensures that all parameters are optimized and SPC reporting is fast and easy.

The 1800 models support high-mix/high-volume throughput at speeds up to 32″ (80cm) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity regardless of component density or board loading, with identical profile performance in either air or nitrogen.

Highest Yields and Tight Process Control

  • The most efficient heat transfer from extra-high volume, high-velocity, heating modules producing heater module response of less than one second to temperature changes of less than 0.1ºC, thereby maintaining profile integrity for heavy board loads.
  • Wide process window for “universal profiling” allows many different boards to be run on a single temperature profile
  • Advanced 5 thermocouple PCB profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs

With a high-capacity, 26″ wide heater module, the 1800 Mark III series reflow oven offers unmatched flexibility in board handling. The oven may be fitted with an adjustable single-rail edge hold conveyor/mesh belt combo, to carry even the largest boards or multi-board panels (up to 20″ wide) through the oven.

This new flux collection system traps the flux in a separate collection box with easy-to-remove plates. As a result, the oven tunnel is kept clean – thus saving time consuming P.M. A collection jar captures the flux and can be removed while the oven is running for the ultimate in time savings.

Enhanced flow heater modules, with 40% larger impeller, blanket the PCB with heat for the lowest delta Ts on the toughest boards. Additionally, the Uniform Gas Management system eliminates net flow, resulting in nitrogen consumption reductions of up to 40%.

Four lead screws ensure the tightest tolerances and parallelism – even on boards with 3mm clearance at the edges.

The new Blow Thru Cooling module provides cool rates of >3º C/sec – even on LGA 775; a rate meets even the most demanding lead-free profile requirements.

Powered by ECD, this innovative software package provides three levels of process control from Oven CpK to Process CpK and Product Traceability, this software ensures that all parameters are optimized and SPC reporting is fast and easy.

The 1900 series is the ultimate high-volume Surface Mount Technology production solution with belt speeds up to 1.4m/min to accommodate the fastest pick-and-place systems while delivering the highest levels of repeatability with the lowest delta Ts.

Highest Yields and Tight Process Control

  • The most efficient heat transfer from extra-high volume, high-velocity, heating modules producing heater module response of less than one second to temperature changes of less than 0.1ºC, thereby maintaining profile integrity for heavy board loads.
  • Wide process window for “universal profiling” allows many different boards to be run on a single temperature profile
  • Advanced 5 thermocouple PCB profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs

With a high-capacity, 26″ wide heater module, the 1900 Mark III series reflow oven offers unmatched flexibility in board handling. The oven may be fitted with an adjustable single-rail edge hold conveyor/mesh belt combo, to carry even the largest boards or multi-board panels (up to 20″ wide) through the oven.

This new flux collection system traps the flux in a separate collection box with easy-to-remove plates. As a result, the oven tunnel is kept clean – thus saving time consuming P.M. A collection jar captures the flux and can be removed while the oven is running for the ultimate in time savings.

Enhanced flow heater modules, with 40% larger impeller, blanket the PCB with heat for the lowest delta Ts on the toughest boards. Additionally, the Uniform Gas Management system eliminates net flow, resulting in nitrogen consumption reductions of up to 40%.

Four lead screws ensure the tightest tolerances and parallelism – even on boards with 3mm clearance at the edges.

The new Blow Thru Cooling module provides cool rates of >3º C/sec – even on LGA 775; a rate meets even the most demanding lead-free profile requirements.

Powered by ECD, this innovative software package provides three levels of process control from Oven CpK to Process CpK and Product Traceability, this software ensures that all parameters are optimized and SPC reporting is fast and easy.

Overall Length
340 cm (134")
No. of Heating Zones
7 Top 7 Bottom
No. of Cooling Zones
1 Bottom Cool Optional
Overall Length
340 cm (134")
No. of Heating Zones
7 Top 7 Bottom
No. of Cooling Zones
1 Bottom Cool Optional