Printers
SJ Inno Tech

SJ Inno Tech Printers with 2D and 3D SPI Solutions

SJ Inno Tech supplies high quality, feature rich printing solutions to the medium to high volume segment of the North American SMT manufacturing market.

There are three major product families in the SJ product line:

  • 2D SPI units: 520S, 680S, 850S, and 1000S models
  • 3D SPI units: the award winning 520 SPI and 850 SPI models
  • LED units: HPX-1300S and HPX-1600S models
KEY FEATURES

The “S” model SJ Inno Tech printers, the 520S, 680S, 850S, 1000S include a standard, full set of features that are options on other machines:

  • 2D solder paste inspection
  • 3-stage conveyor with automatic width adjustment
  • Closed loop programmable load cell squeegee pressure system
  • Top link/edge clamping system with robust 4.5” wide rails
  • Under-stencil cleaning system
  • Intuitive, easy-to-use software

2D SPI is standard equipment with the S series printers

  • Uses the printer’s camera system to check for insufficient solder and/or solder misalignment
  • “Serial” process performed after printing, while the PCB is still in the print area, typically performed on a sample basis due to additional cycletime required

3-Stage High Speed Conveyor is standard equipment

  • Will buffer one PCB on the entrance and one on the exit of the conveyor, minimizing cycletime through the machine
  • Large 4.5” conveyor rails, with TopLink and side snugger clamping systems, are standard
  • The 4.5” conveyor rails provide a more robust platform for long-term accuracy and repeatability
  • The standard TopLink clamp system works with the support tooling to ensure accurate Z position of the top of the PCB to the edge of the rail; this is critical for good gasketing with the stencilT
  • The standard side snuggers hold the PCB tightly to ensure no movement during the print stroke
  • For PCBs less than .8mm (.032”), the standard precision-machined .1mm knife-edge clamps hold the PCB securely without causing bowing which might be possible if using the side snuggers alone

Closed Loop Load Cell Squeegee Pressure control is standard

  • Squeegee pressure is continually monitored in real time by the load cell and maintains programmed pressure through any height variations
  • No Squeegee calibration is required, it is performed “on the fly”

Under-Stencil Cleaning system is standard equipment

  • The cleaner has the following functions:
    • Vacuum (2 ports)
    • Blow
    • Cleanser Dispensing
    • Automatic Paper Winding
  • Four 5mm-wide contact points ensure good stencil cleaning
  • The USC uses a high-capacity vacuum motor, not weaker venturi systems as used by some competitors

Orbital Cleaning System (OCS) is standard :

  • “Waves” or “orbits” the stencil laterally while the cleaning unit is moving across the stencil
  • Improves cleaning action and aperture evacuation

Extended Zone Printing (EZP) mode allows programming of 5 different speeds and pressure zones for each print direction

  • Difficult jobs, or jobs that require different pressure settings, are easily accommodated using EZP Mode
  • Examples of where you might want to slow down the print speed and adjust pressure are in fine pitch areas of the stencil or step stencil sections
  • Relatively empty areas or simple passives run at higher squeegee speeds, enabling higher throughput

Rugged Machine Structure:

  • The SJ Inno Tech Frame System has machined, welded, steel construction that has undergone heat treatment and is built to prevent twisting or mechanical distortion
  • This frame provides a reliable and stable platform for decades of use

Lead screw-driven servo motors with optical encoders provide fast and accurate alignment of the PCB and Stencil alignment camera. (Many competitors use belt drive systems, requiring more maintenance and calibration over the years)

Simple, User-Friendly Operation Software

  • Easy-to-follow, tab-based programming is simple to learn and use
  • Graphical displays show the operator/programmer details on the setting

Custom Tooling:

  • SJ Printers easily accommodate custom-tooling options from secondary sources
  • Vacuum tool plates, under-board supports are easily designed or implemented

Quick Setup Tooling:

  • Quik Tool rapid setup systems are available

 

Solderpaste Dispensing System:

  • To maintain quantity of solder paste on the stencil uniformly the production tech has to monitor the quantity of solder paste and load the solder paste manually. Using an auto solder paste dispenser, you can eliminate this operation and minimize the manual work of the operator.
  • Includes Paste Height Detector to initiate dispensing, ensuring consistent roll height and paste deposition on the PCB

Dot Dispensing System:

  • Two different types of material can be dispensed
  • High quality Positive Displacement pumps
  • Includes a Laser PCB height sensor
  • Includes a Nozzle touch sensor and Purge area.
  • Uses 10cc #2 EFD style cartridge and Luer lock syringes
  • Fiducials and dispense coordinates can be taught via camera teach
  • Can dispense up to 100 sites per PCB at about 1s per dot

Traceability system:

  • Bar codes can be read from the Paste, Squeegee, and Stencil to ensure the job is properly set up
  • An additional Traceability option is available which will read barcodes on the PCB by the machine cameras to document all the pertinent data by individual board, giving full PCB level traceability.
  • Up to a 7 x 7mm size 2D barcode label on the PCB can be read by the printer’s camera system

Environmental Control System:

  • “Non Blowing” air system
  • Cooling capacity of 2,500 kcal/h
  • 1.6 kw Heater
  • Setting temp range of 20-30 degrees C (68-86 degrees F)
  • 220vac, 15 amps

The HPX 1300S model SJ Inno Tech printer is designed for LED lighting PCBs that are up to 1240mm (48.8”) long. The new HPX 1600S will print PCBs up to 1500mm (59″) long. The HPX models include a full set of features standard that are options on many competitors’ machines:

  • 2D solder paste inspection
  • Automatic width adjustment
  • Closed loop programmable squeegee pressure system
  • Top link/edge clamping system with robust 4.5” wide rails
  • Under stencil cleaning system
  • Innovative X axis squeegee direction for improved print quality
  • Intuitive, easy-to-use software

The SJ-HPX models share the same full set of features as the SJ-S models PLUS the additional X direction squeegee printing benefits:

  • Standard length, inexpensive squeegee blades can be used
  • Better print control over the print stroke
  • Less solder paste waste, much shorter paste roll length

Image inside the printer showing the X-Axis head and squeegee assembly

Primarily application is for long LED lamp PCBs, for use in the change over from fluorescent to LED lighting systems around the world

ITEM SPECIFICATIONS
STENCIL SIZE (LxW)
43.31″, 47.24″, 51.18″, 55.11″, 59.06″, 62.21″ x 25.59″, 28.98″,

31.49″ (1100,1200,1300,1400,1500,1580 x 650,736,800mm)

Image Origin Front/Center Justified
PCB PCB SIZE(Min) 7.8″x 5.9″( 200 x 150mm)
PCB SIZE (Max) 48.8″ x 17.7″ (1240 x 450mm), 59″ x 17.7″ (1500 x 450mm) HPX-1600S
PCB Thickness .0157″- .236″ (0.4-6.0mm)
PCB Clamping Top link clamping and top knife edge clamping
PCB Support Magnetic support pins or magnetic support blocks
Cycletime* 15-20 sec

*Overhead excluding print stroke

Transfer height 900 +/- 30 mm
Print direction X axis
PRINTING Speed 1 – 7.9 in/s (1-200 mm/s) (Incremental 0.01mm/S)
Pressure 0.1 – 50kg/f , Software Programmable (110 lbs)
Speed and Pressure Digital control for speed and pressure of squeegee
by each working section
Snap off distance 0 – .2″ (0-5.00mm) (Incremental 0.01mm)
Separation Speed 1 – 5.90 in/s (1-150mm/s) (Incremental 0.01mm/s)
Separation distance 0 – .393″ (0-10mm) (Incremental 0.01mm)
Accuracy 25 micron, CpK  2 (6 sigma)
Repeatability 12.5 micron, CpK  2 (6 sigma)
Vision camera and board EIA-G20E30 Camera (Sony OEM)
– IPX Vision Board
– Euresys Library Application
Vision Processing Real-time image transfer to vision system with 256 Gray Scale
IIumination Method Excellent R.C.B 3 Channel Indirect Illumination,

regardless of mark site and quality of the substrate material

VISION PARAMETERS Fiducials All fiducial marks readable, plus pattern matching
Operation Dual vacuum unit: wet, dry, vacuum and blow
Operating System PC Windows 7,TFT-LCD 17″
Power Single Phase AC220V (50/60Hz) 6Kw
FACILITIES Air 75 psi, 1.4 cfm (5kg/f, 40NI/min)
Weight 4409 lbs (2000 kg)
Dimension(LXWXH) 74”x 62.4″x 56.9″ (1880 x1585 x1445mm)

Major System Options –

Solderpaste Dispensing System:

  • To maintain quantity of solder paste on the stencil uniformly the production tech has to monitor the quantity of solder paste and load the solder paste manually. Using an auto solder paste dispenser, you can eliminate this operation and minimize the manual work of the operator.
  • Includes Paste Height Detector to initiate dispensing, ensuring consistent roll height and paste deposition on the PCB

Traceability system:

  • Bar codes can be read from the Paste, Squeegee, and Stencil to ensure the job is properly set up
  • An additional Traceability option is available which will read barcodes on the PCB by the machine cameras to document all the pertinent data by individual board, giving full PCB level traceability.
  • Up to a 7 x 7mm size 2D barcode label on the PCB can be read by the printer’s camera system

Environmental Control System:

  • “Non Blowing” air system
  • Cooling capacity of 2,500 kcal/h
  • 1.6 kw Heater
  • Setting temp range of 20-30 degrees C (68-86 degrees F)
  • 220vac, 15 amps

The SJ Inno Tech “3DSPI” model printers, the 520SPI and 850SPI are the only full-featured printers in the world to include real-time, full-PCB 3D SPI without impacting print cycletime. The 3DSPI models also include the same standard set of features as the S models:

  • 3D Solder Paste Inspection for the full PCB with autofeedback
  • 2D solder paste inspection
  • 3-stage conveyor with automatic width adjustment
  • Closed loop programmable squeegee pressure system
  • Top link/edge clamping system with robust 4.5” wide rails
  • Robust machine frame, 50% more massive than competitors’ machines
  • Intuitive, easy-to-use software

The 520 and 850 SPI models share the same features described in the S models tab PLUS the following additional features:

Full PCB Parallel Processing 3DSPI with AutoFeedback is standard equipment

  • A separate gantry camera system to perform 3D SPI on the previously printed PCB
  • A “parallel” process, performed while the next PCB is being printed, therefore not effecting process cycletime Capt: 3D SPI images
  • The SPI will automatically feedback any print offset in X, Y and rotation back to the printer to improve print performance
  • Additional “rules” can be programmed to be fed back from the SPI system to the printer, such as:
    • A stencil wipe when bridges or smudges are detected
    • Increase squeegee pressure when paste height is continually above nominal
    • Custom rules can be established to meet specific user requirements
  • Feedback is from Right to Left: First board printed is on right, most recent one showing improved accuracy is to left
  • Feedback to printer is separated by “in” and “out” print stroke, red shows in, blue shows back stroke direction
  • Print accuracy will continue to improve as more PCBs are printed

 

SPI Closed Loop Feedback Process:

  • The SPI will automatically feedback any print offset in X, Y and rotation to the printer to improve print performance
  • Additional “Rules” can be programmed to be fed back from the SPI system to the printer, such as:
    • A stencil wipe when bridges or smudges are detected
    • Increase squeegee pressure when paste height is continually above nominal
  • User defined rules can be programmed as well

SPI Data Viewing:

  • After scanning, the system calculates accurate pad volume information
  • If there are print errors, the SPI will stop and alert the operator, giving detailed error data
  • The print on the right has a bridge error highlighted in red, and its location identified by crosshairs on PCB
  • If the print is good, the board will be released downline and correction information will be fed upline

3D SPI – How it works:

  • The 3D camera has a Dual Light Source, which eliminates all shadowing effects.
  • Utilizing the PMP (Phase Measuring Profilometry) Algorithm, deposit height is accurately measured from the reference plane

The 3DSPI utilizes Moire Technology – detects Paste Height differences as image shifts

2D and 3D Phase Shifting Technology: The camera detects the Zero reference point and inspects solder shapes

  • Some competitors use a method which can only recognize solder higher than 40 um, making it impossible for accurate measurements below that height
  • SJ/Pemtron solved this problem by using an Enhanced 3D Color Algorithm that defines solder printed from an accurately derived Zero reference point.
  • The result is a high definition paste image, and a full size PCB is inspected typically in 6-10 seconds
  • There is no bottle neck created during production because of rapid inspection time
  • Quality of work dramatically increases and re-work costs drop significantly

Additional Key Benefits of our built-in parallel processing 3D SPI:

  • Eliminates requirement for a separate stand-alone SPI machine
  • Saves space and cost: printer, conveyor and separate SPI unit all combined into a single unit
  • No software cost or hassle in getting an external SPI unit to communicate and provide feedback to the printer

Full SPC Reporting capabilities:

  • Complete Histogram reporting
  • Complete history or hourly break down of Min, Max, Sigma, CP and CPK
  • Print or save data reports in Word, Excel or PDF format

Complete Bad Print/No Good (NG) data is available

  • Complete and comprehensive SPC Data is available on single or multiple printers, multiple lines and multiple factory data settings
  • SPC can be exported from SJ printer or stored on server for multiple lines, multiple factory tracking convenience
  • Fields can be individually formatted to user preferences
ITEM SPECIFICATIONS
STENCIL SIZE (LxW) 520 SPI :23.6″ x 21.6″ (600 x 550mm), 25.6″ x 21.6″ (650 x 550mm, 29″x 29″ (736 x 736mm)
850 SPI : 29” x 29” (736 x 736mm), 31.5 x 31.5” (800 x 800mm)

37.4 x 31.5” (900 x 800mm), 39.4” x 31.5” (1000 x 800mm)

Image Origin Front/Center Justified
PCB PCB SIZE(Min) 520 SPI : 2″x 2″( 50 x 50mm)

850 SPI : 2.7” x 2.7” (70 x 70mm)

PCB SIZE (Max) 520 SPI : 20″ x 16.5″ (520 x 420mm)

850 SPI : 33.5″ x 17″ (850 x 480mm)

PCB Thickness .0078″- .236″ (0.2 – 6.0mm)
PCB Clamping Top link clamping and top knife edge clamping
PCB Support Magnetic support pins or magnetic support blocks
Cycletime* 520 SPI : 7 sec

850 SPI : 12 sec

*Overhead excluding print stroke

Transfer height 900 +/- 30 mm
Print direction Front
PRINTING Speed 1 – 5.9 in/s (1-150 mm/s) (Incremental 0.01mm/S)
Pressure 0.1 – 40kg/f , Software Programmable, (60 kg/f on 680 and 850)
Speed and Pressure Digital Control for Speed and Pressure of Squeegee
by each working section
Snap off distance 0 – .2″ (0-5.00mm) (Incremental 0.01mm)
Separation Speed 1 – 5.90 in/s (1-150mm/s) (Incremental 0.01mm/s)
Separation distance 0 – .393″ (0-10mm) (Incremental 0.01mm)
Accuracy 25 micron, CpK = 2 (6 sigma)
Repeatability 12.5 micron, CpK = 2 (6 sigma)
Vision camera and board EIA-G20E30 Camera (Sony OEM)
– IPX Vision Board
– Euresys Library Application
Vision Processing Real-time image transfer to vision system with 256 Gray Scale
IIlumination Method Excellent R.C.B 3 Channel Indirect Illumination, regardless of marks site and quality of substrate material
VISION PARAMETERS Fiducials All fiducial marks readable, plus pattern matching
Operation Dual-vacuum unit: Wet, dry, vacuum and blow
Operating System PC Windows 7,TFT-LCD 17″
Power Single Phase AC220V (50/60Hz) 6Kw
FACILITIES Air 75 psi, 1.4 cfm (5kg/f, 40NI/min)
Weight 520 SPI : 3300 lbs (1500 kg)

850 SPI : 3960 lbs (1800 kg)

Dimension(LXWXH) 520 SPI : 81.1″x 62.6″x 56.9″ (2060 x1590 x1445mm)

850 SPI : 100.4″x 68.9″x 56.9″ (2550 x1750 x1445mm)

Major System Options:

Solderpaste Dispensing System

  • To maintain quantity of solder paste on the stencil uniformly the production tech has to monitor the quantity of solder paste and load the solder paste manually. Using an auto solder paste dispenser, you can eliminate this operation and minimize the manual work of the operator.
  • Includes Paste Height Detector to initiate dispensing, ensuring consistent roll height and paste deposition on the PCB

Dot Dispensing System :

  • Two different types of material can be dispensed
  • Includes a Laser PCB height sensor
  • Fiducials and dispense coordinates can be taught via camera teach
  • Includes a Nozzle touch sensor and Purge area.
  • Uses 10cc #2 EFD style cartridge and Luer lock syringes
  • Can dispense up to 100 sites per PCB at about 1s per dot

Traceability system:

  • Bar codes can be read from the Paste, Squeegee, and Stencil to ensure the job is properly set up
  • An additional Traceability option is available which will read barcodes on the PCB by the machine cameras to document all the pertinent data by individual board, giving full PCB level traceability.
  • Up to a 7 x 7mm size 2D barcode label on the PCB can be read by the printer’s camera system

Environmental Control System:

  • “Non Blowing” air system
  • Cooling capacity of 2,500 kcal/h
  • 1.6 kw Heater
  • Setting temp range of 20-30 degrees C (68-86 degrees F)
  • 220vac, 15 amps