XRAY
XAVIS Corporation

Premium X-ray inspection solutions for the PCB and Semiconductor markets

Xavis has built a rapidly growing worldwide market share as a provider of x-ray inspection systems for destructive and non-destructive mechanical testing and inspection of electrical components. Xavis supplies solutions for Micro- and Nanofocus 2D industrial X-ray inspection, as well as Computed Tomography (CT), 3D failure analysis, and inline X-ray inspection. Xavis has achieved ISO 9001 certification, and has both UL and CE listings for their products.

ApexFA distributes the Xavis products primarily focused on the SMT and Semiconductor market in the Americas. These product lines include the:

  • A Series machines: Fully featured 2D X-ray machines, with optional 3D Cone Beam technology for small sample size (usually destructive) CT testing
  • H Series machines: 3D X-ray machines with sophisticated 7-axis manipulation and oblique angle viewing, giving full PCB 3D non-destructive CT capability
KEY FEATURES

The A90 is a fully configured X-ray inspection solution featuring:

  • 2D X-ray inspection, with a high-resolution FPD (Flat Panel Detector)
  • Powerful, yet easy-to-use operator interface software
  • 4-axis manipulator with 50-degree detector tilt
  • 2D AXi capability, to program an inspection path and automatically detect errors or product defects
  • Cone Beam Micro CT option to add 3D capability for small parts or part sections

Full-size PCB capability

  • Standard Model:
    • Table Size ( Inspection Area) = 500 x 500 mm (19.6” x 19.6”)
  • Wide Model (Option):
    • Table Size (Inspection Area) = 650 x 550 mm (25.6” x 21.6”)

X-Ray Tube

  • Closed-Type, Focal Spot Size : 3µm
  • The 10w, 90kv tube allows clear imaging through denser objects than other lower-power units

FPD

  • The proprietary XAVIS 6.8 Mpixel Flat Panel Detector, with standard 5-inch Active Area, gives a class-leading 2944 x 2352 pixel image

 

Auto Mapping (Programming) for Manual Inspection functionality is standard. Programming is a series of steps for your product to move the x-ray manipulator around for ease of inspection. For example, in the shown sample, the whole panel will be inspected in groups of 9 chips as it steps through the program.

Pseudo Imaging enhances X-ray object viewing at various angles on the 2D X-ray units that do not have CT capabilities.

Auto Void inspection for BGAs will detect voids in excess of programmed parameters and reject product, see NG ball identified in red on lower left.

2D AXi auto-inspection software will check for and reject shorts, missing parts, tombstoned and misaligned components and will document all defects.

Cone Beam MicroCT option allows full 3D CT capability for samples up to 50 x 50mm. This is useful for small PCBs or cut-out sections of larger PCBs. Once it is fully scanned and rendered, the image may be viewed from any angle and sliced in any direction to examine any part of the object in great detail.

3D volume rendering software option takes Cone Beam MicroCT images and generates viewable and easily manipulable images for easy and in-depth, full 3D object inspection.

KEY FEATURES

The A100 is a fully configured X-ray inspection solution featuring:

  • 2D X-ray inspection, with a high-resolution FPD (Flat Panel Detector)
  • Powerful, yet easy-to-use operator interface software
  • 4-axis manipulator with 50-degree detector tilt
  • 2D AXi capability, to program an inspection path and automatically detect errors or product defects
  • Cone Beam Micro CT option to add 3D capability for small parts or part sections

Full-size PCB capability

  • Standard Model:
    • Table Size ( Inspection Area) = 500 x 500 mm (19.6” x 19.6”)
  • Wide Model (Option):
    • Table Size (Inspection Area) = 650 x 550 mm (25.6” x 21.6”)

X-Ray Tube

  • Closed-Type, Focal Spot Size : 5µm, with minimum detectability of 3µm
  • The higher power 10w, 100kv tube allows clear imaging through denser objects than other lower-power units

FPD

  • The proprietary XAVIS 6.8 Mpixel Flat Panel Detector, with standard 5-inch Active Area, gives a class-leading 2944 x 2352 pixel image

 

Auto Mapping (Programming) for Manual Inspection functionality is standard. Programming is a series of steps for your product to move the x-ray manipulator around for ease of inspection. For example, in the shown sample, the whole panel will be inspected in groups of 9 chips as it steps through the program.

Pseudo Imaging enhances X-ray object viewing at various angles on the 2D X-ray units that do not have CT capabilities.

Auto Void inspection for BGAs will detect voids in excess of programmed parameters and reject product, see NG ball identified in red on lower left.

2D AXi auto-inspection software will check for and reject shorts, missing parts, tombstoned and misaligned components and will document all defects.

Cone Beam MicroCT option allows full 3D CT capability for samples up to 50 x 50mm. This is useful for small PCBs or cut-out sections of larger PCBs. Once it is fully scanned and rendered, the image may be viewed from any angle and sliced in any direction to examine any part of the object in great detail.

3D volume rendering software option takes Cone Beam MicroCT images and generates viewable and easily manipulable images for easy and in-depth, full 3D object inspection.

KEY FEATURES

The A130 is a fully configured X-ray inspection solution featuring:

  • 2D X-ray inspection, with a high-resolution FPD (Flat Panel Detector)
  • Powerful, yet easy-to-use operator interface software
  • 4-axis manipulator with 50-degree detector tilt
  • 2D AXi capability, to program an inspection path and automatically detect errors or product defects
  • Cone Beam Micro CT option to add 3D capability for small parts or part sections

Full-size PCB capability

  • Standard Model:
    • Table Size ( Inspection Area) = 500 x 500 mm (19.6” x 19.6”)
  • Wide Model (Option):
    • Table Size (Inspection Area) = 650 x 550 mm (25.6” x 21.6”)

X-Ray Tube

  • Closed-Type, Focal Spot Size : 5µm, with minimum detectability of 3µm
  • The higher power 10w, 130kv tube allows clear imaging through denser objects than other lower-power units

FPD

  • The proprietary XAVIS 6.8 Mpixel Flat Panel Detector, with standard 5-inch Active Area, gives a class-leading 2944 x 2352 pixel image

 

Auto Mapping (Programming) for Manual Inspection functionality is standard. Programming is a series of steps for your product to move the x-ray manipulator around for ease of inspection. For example, in the shown sample, the whole panel will be inspected in groups of 9 chips as it steps through the program.

Pseudo Imaging enhances X-ray object viewing at various angles on the 2D X-ray units that do not have CT capabilities.

Auto Void inspection for BGAs will detect voids in excess of programmed parameters and reject product, see NG ball identified in red on lower left.

2D AXi auto-inspection software will check for and reject shorts, missing parts, tombstoned and misaligned components and will document all defects.

Cone Beam MicroCT option allows full 3D CT capability for samples up to 50 x 50mm. This is useful for small PCBs or cut-out sections of larger PCBs. Once it is fully scanned and rendered, the image may be viewed from any angle and sliced in any direction to examine any part of the object in great detail.

3D volume rendering software option takes Cone Beam MicroCT images and generates viewable and easily manipulable images for easy and in-depth, full 3D object inspection.

KEY FEATURES

The H130-OCT is a fully configured 3D X-ray inspection solution featuring:

  • Both 2D and 3D Oblique Computed Tomography (OCT) X-ray inspection system
  • The H130 gives full board/object non-destructive CT imaging
  • Powerful, yet easy-to-use operator interface software
  • 7-axis manipulator, with detector tilt of 60 degrees
  • 2D and 3D AXi capability available to program an inspection path and automatically detect errors or product defects

Full-size PCB capability

  • Table Size = 525 x 540 mm (20.7” x 21.2”)
  • 3D Inspection Area = 330 x 330 mm (13” x 13”)

X-Ray Tube

  • Closed-Type, Focal Spot Size : 5µm and Minimum Detectability : 3µm
  • The high power 39w, 130kv tube allows clear imaging through denser objects than other lower-power units

High Resolution 6.8 Mpixel FPD

  • The proprietary XAVIS 6.8 Mpixel Flat Panel Detector, with standard 5-inch Active Area, gives a class-leading 2944 x 2352 pixel image

 

7 Axis Drive System: A very robust 7 axis drive system enables quick, accurate movement for rapid 3D CT image acquisition.

Auto Mapping (Programming) for Manual Inspection functionality is standard. Programming is a series of steps for your product to move the x-ray manipulator around for ease of inspection. For example, in the shown sample, the whole panel will be inspected in groups of 9 chips as it steps through the program.

2D AXi auto-inspection software will check for and reject shorts, missing parts, tombstoned and misaligned components and will document all defects.

Oblique CT (OCT) technology allows nondestructive full CT imaging over a large PCB area.

Cone Beam MicroCT is available as an option for high resolution imaging of very small  objects, under 20mm square.

a100-6

Auto 2D Void inspection for BGAs will detect voids in excess of programmed parameters and reject product, see NG ball identified in red on lower left. This software is often used even on CT machines for first pass checking, suspect balls may then undergo 3D CT to get higher resolution and manipulable images for best determination of defect status.

3D rendering software option genea100-12rates viewable images for easy and in-depth, full 3D object inspection.

2

Sophisticated Imaging Software allows easy defect viewing and manipulation, note the large void in the center ball

a100-143D BGA automatic void detection software option will automate the 3D void inspection process.

KEY FEATURES

The H160-OCT is a fully configured 3D X-ray inspection solution featuring:

  • Both 2D and 3D Oblique Computed Tomography (OCT) X-ray inspection system
  • The H160 gives full board/object non-destructive CT imaging
  • Powerful, yet easy-to-use operator interface software
  • 7-axis manipulator, with detector tilt of 60 degrees
  • 2D and 3D AXi capability available to program an inspection path and automatically detect errors or product defects

Full-size PCB capability

  • Table Size = 525 x 540 mm (20.7” x 21.2”)
  • 3D Inspection Area = 330 x 330 mm (13” x 13”)

X-Ray Tube

  • Open-Type, Focal Spot Size : 1.4µm and Minimum Detectability : .7µm
  • Both BE and Diamond targets are available, 10 and 23 watt power capability respectively
  • The high power 160kv tube allows clear imaging through denser objects than other lower-power units

High Resolution 6.8 Mpixel FPD

  • The proprietary XAVIS 6.8 Mpixel Flat Panel Detector, with standard 5-inch Active Area, gives a class-leading 2944 x 2352 pixel image

 

7 Axis Drive System: A very robust 7 axis drive system enables quick, accurate movement for rapid 3D CT image acquisition.

Auto Mapping (Programming) for Manual Inspection functionality is standard. Programming is a series of steps for your product to move the x-ray manipulator around for ease of inspection. For example, in the shown sample, the whole panel will be inspected in groups of 9 chips as it steps through the program.

2D AXi auto-inspection software will check for and reject shorts, missing parts, tombstoned and misaligned components and will document all defects.

Oblique CT (OCT) technology allows nondestructive full CT imaging over a large PCB area.

Cone Beam MicroCT is available as an option for high resolution imaging of very small  objects, under 20mm square.

a100-6

Auto 2D Void inspection for BGAs will detect voids in excess of programmed parameters and reject product, see NG ball identified in red on lower left. This software is often used even on CT machines for first pass checking, suspect balls may then undergo 3D CT to get higher resolution and manipulable images for best determination of defect status.

vx3dVX3D imaging software: Once the subject area has undergone CT and rendering, the powerful VX3D viewing software allows easy image manupulation

VX3D genea100-12rates viewable images for easy and in-depth, full 3D object inspection.

2

VX3D images allow easy defect viewing and manipulation, note the large void in the center ball

a100-143D BGA automatic void detection software option will automate the 3D void inspection process.

led
Ultra high resolution
zoomed images are available with the H-160. Here is an image pf wirebonds to a LED.

 

vias

Ultra High Resolution image of an open via in a ceramic substrate.

Tube Type
Closed
Tube-Focal Spot Size
5 µm
Voltage/Current
100 kv/250uA
Magnification
x214/x429
X-Ray Detector
FPD (Flat Panel Detector)
Tilt Angle
Detector tilt 50 degrees
Manipulator
4-axis (X, Y, Z, Tilt)
Table Size
500 x 500mm (19.6” x 19.6”)
Maximum Sample Weight
5 kg (11 lbs)
X-Ray Leakage
<1uSv/hour
Dimensions
136 x 144 x 170cm (54" x 57" x 67”)
Weight
1,400 kg (3,080 lbs)
Power Requirement
220 vac single phase 50/60 Hz
Tube Type
Closed
Tube-Focal Spot Size
5 µm
Voltage/Current
100 kv/250uA
Magnification
x214/x429
X-Ray Detector
FPD (Flat Panel Detector)
Tilt Angle
Detector tilt 50 degrees
Manipulator
4-axis (X, Y, Z, Tilt)
Table Size
500 x 500mm (19.6” x 19.6”)
Maximum Sample Weight
5 kg (11 lbs)
X-Ray Leakage
<1uSv/hour
Dimensions
136 x 144 x 170cm (54" x 57" x 67”)
Weight
1,400 kg (3,080 lbs)
Power Requirement
220 vac single phase 50/60 Hz
Tube Type
Closed
Tube-Focal Spot Size
5 µm
Voltage/Current
100 kv/250uA
Magnification
x214/x429
X-Ray Detector
FPD (Flat Panel Detector)
Tilt Angle
Detector tilt 50 degrees
Manipulator
4-axis (X, Y, Z, Tilt)
Table Size
500 x 500mm (19.6” x 19.6”)
Maximum Sample Weight
5 kg (11 lbs)
X-Ray Leakage
<1uSv/hour
Dimensions
136 x 144 x 170cm (54" x 57" x 67”)
Weight
1,400 kg (3,080 lbs)
Power Requirement
220 vac single phase 50/60 Hz
Tube Type
Closed
Tube-Focal Spot Size
5 µm
Voltage/Current
130 kv/300uA
Magnification
x 180
X-Ray Detector
FPD (Flat Panel Detector)
Tilt Angle
Detector tilt 60 degrees
Manipulator
7-axis (X, X1,Y, Y1, Z, Tilt, table rotation)
Table Size
540 x 525 mm (21.3” x 20.7”)
Maximum Sample Weight
5 kg (11 lbs)
X-Ray Leakage
<1uSv/hour
Dimensions
160 x 160 x 180cm (63" x 63" x 71”)
Weight
3,000 kg (6,600 lbs)
Power Requirement
220 vac single phase 50/60 Hz
Tube Type
Open
Tube-Focal Spot Size
1 µm, .7 µm detectability
Voltage/Current
160 kv/300uA
Magnification
x 15,000
X-Ray Detector
FPD (Flat Panel Detector)
Tilt Angle
Detector tilt 60 degrees
Manipulator
7-axis (X, X1,Y, Y1, Z, Tilt, table rotation)
Table Size
540 x 525 mm (21.3” x 20.7”)
Maximum Sample Weight
5 kg (11 lbs)
X-Ray Leakage
<1uSv/hour
Dimensions
160 x 160 x 180cm (63" x 63" x 71”)
Weight
3,500 kg (7,700 lbs)
Power Requirement
220 vac single phase 50/60 Hz